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package stacking
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TESSERA TECHNOLOGIES
UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
MCP
package design
CSP
BGA
memory modules
ball grid array
advanced packaging
micro BGA
chip scale
DDR II
FBGA
fold-over
chip scale package
UBGA
3D packaging
land grid array
3D package
integrated passives
die stacking
ball stack
die stack
fine pitch BGA
package solutions
chip scale technology
compliant chip
compliant layer
multi-chip
MBGA
microZ miniaturization
multi-chip package
package stacking
global.tessera.com - 2009-04-09
integrated passives
land grid array
fine pitch bga
chip scale package
csp
fold-over
ball grid array
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